Datasheet

TX power level setting
TX Power (dBm)
19.00
17.00
15.00
13.00
11.00
9.00
7.00
5.00
3.00
1.00
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
54 OFDM
280.00
264.40
249.00
233.30
218.00
202.00
186.70
171.00
155.60
140.00
IBAT (VBAT @ 3.6 V)(mAmp)
Color by
TX Power (dBm)
IBAT (VBAT @ 3.6 V)
CC3100
www.ti.com SWAS031D –JUNE 2013–REVISED FEBRUARY 2015
Figure 4-5. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
4.10 Thermal Characteristics for RGC Package
AIR FLOW
PARAMETER 0 lfm (C/W) 150 lfm (C/W) 250 lfm (C/W) 500 lfm (C/W)
θ
ja
23 14.6 12.4 10.8
Ψ
jt
0.2 0.2 0.3 0.1
Ψ
jb
2.3 2.3 2.2 2.4
θ
jc
6.3
θ
jb
2.4
4.11 Timing and Switching Characteristics
4.11.1 Power Supply Sequencing
For proper operation of the CC3100 device, perform the recommended power-up sequencing as follows:
1. Tie V
BAT
(pins 37, 39, 44) and V
IO
(pins 54 and 10) together on the board.
2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit (100K ||
0.1 µF, RC = 10 ms).
3. For an external RTC clock, ensure that the clock is stable before RESET is deasserted (high).
For timing diagrams, see Section 4.11.2, Reset Timing.
4.11.2 Reset Timing
4.11.2.1 nRESET (32K XTAL)
Figure 4-6 shows the reset timing diagram for the 32K XTAL first-time power-up and reset removal.
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