User's Manual

Table Of Contents

SWRU326-013

www.ti.com

Table 3-1. Module Layout Guidelines

Reference

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Guideline Description

1 The proximity of ground vias must be close to the pad.

2 Signal traces must not be run underneath the module on the layer where the module is mounted.

3 Have a complete ground pour in layer 2 for thermal dissipation.

4 Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.

5 Increase the ground pour in the first layer and have all of the traces from the first layer on the inner

layers, if possible.

6 Signal traces can be run on a third layer under the solid ground layer, which is below the module

mounting layer.

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See Figure 3-2.

Figure 3-2. Module Layout Guidelines

Figure 3-3 shows the trace design for the PCB. A 50-Ω impedance match on the trace to the antenna

should be used. Also, 50-Ω traces are recommended for the PCB layout. Table 3-2 lists the distances

shown in Figure 3-3. Figure 3-4 shows layer 1 with the trace to the antenna over ground layer 2. Table 3-3

and Figure 3-5 describe instances of good layout practices for the antenna and RF trace routing.

SWRU326–November 2012 Layout Guidelines

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