Datasheet

BUF08832EVM Documentation www.ti.com
6.2 BUF08832_Test_Board Bill of Materials
Table 4 lists the bill of materials for this EVM.
Table 4. BUF08832_Test_Board Bill of Materials
No. Qty Value Ref Des Description Vendor Part number
RES 34.0Ω 1% 50PPM 1/4W See
1 1 34Ω R1 Vishay/Dale CMF5034R000FHEB
Assembly Drawing
RES 1.21kΩ 1% 50PPM 1/4W
2 1 1.2kΩ R2 Vishay/Dale CMF501K2100FHEB
See Assembly Drawing
RES 150Ω 1% 50PPM 1/4W See
3 1 150Ω R3 Vishay/Dale CMF50150R00FHEB
Assembly Drawing
4 1 249kΩ R4 RES 249kΩ 1/16W .5% 0603 SMD Susumu Co Ltd RR0816P-2493-D-39D
5 2 4.7uF C1, C9 CAP TANT 4.7µF 35V 10% SMD Vishay/Sprague 293D475X9035C2TE3
Murata Electronics
6 2 1µF C2, C10 CAP CER 1 µF 25V Y5V 0603 GRM188F51E105ZA12D
North America
CAP .10µF 25V CERAMIC Y5V
7 6 0.1µF C3-C8 Kemet C0603C104Z3VACTU
0603
8 1 U1 Socket, TSSOP 28-Pin ZIF ENPLAS OTS-20(28)-0.65-01
CONN RCPT .100" 10POS GOLD
9 2 U2 Samtec Inc SS-110-G-2
T/H
IC BUFFER SCHMIT TRIG
10 1 U3 Texas Instruments SN74LVC1G17DBVR
SOT235
CONN D-SUB PLUG R/A 25POS
11 1 DSUB25M J1 30GOLD (With Threaded Inserts AMP/Tyco Electronics 5747842-4
and Board locks)
SWITCH TOGGLE SPDT .4VA PC
12 1 S1 E-Switch 200AWMSP1T1A1M2RE
MNT
13 3 T1, T3, T4 TERM BLOCK .2 IN 2 POS PCB Tyco Electronics 1437671-1
TERM BLOCK 3POS 5.08MM
14 1 T2 Tyco Electronics 1437671-4
SCREWLESS
CONN HEADER 10POS .100"
15 1 T5 Cut to size T5 Samtec TSW-132-07-G-S
SGL GOLD
Pin SOCKET RCPT .014-.026
16 6 Pin Socket (U1) AMP 5050863-5
30AU (R1,R2,R3)
CONN HEADER 1POS .100" SGL
17 8 TP cut to size Test Points, All Samtec TSW-132-07-G-S
GOLD
Standoffs, Hex , 4-40 Threaded,
18 4 Standoff — 0.500" length, 0.250" OD, Keystone 2203
Aluminum Iridite Finish
SCREW MACHINE PHIL 4-40X1/4
19 4 Screw — Building Fasteners PMSSS 440 0025 PH
SS
JUMP3 cut to CONN HEADER 3POS .100" SGL
20 5 JMP1-JMP5 Samtec TSW-132-07-G-S
size GOLD
SHUNT LP W/HANDLE 2 POS
21 5 N/A AMP/Tyco Electronics 881545-2
30AU
IC CURR/PWR MON BI-DIR
22 1 BUF08832 U1 Texas Instruments BUF08832AIDGS
MSOP-10
30
BUF08832EVM User Guide and Software Tutorial SBOU081–November 2009
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