Datasheet

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6.3 BUF08630_Test_Board Bill of Materials
Table 4 lists the bill of materials for this EVM.
Table 4. BUF08630_Test_Board Bill of Materials
No. Qty Value Ref Des Description Vendor Part number
Resistor, 34.0Ω 1% 50PPM 1/4W,
1 1 34Ω R1 See assembly drawing in Vishay/Dale CMF5034R000FHEB
Figure 29
Resistor, 1.21KΩ 1% 50PPM
2 1 1.2kΩ R2 1/4W, See assembly drawing in Vishay/Dale CMF501K2100FHEB
Figure 29
Resistor, 150Ω 1% 50PPM 1/4W,
3 1 150Ω R3 See assembly drawing in Vishay/Dale CMF50150R00FHEB
Figure 29
Resistor, 249kΩ 1/16W .5% 0603
4 1 249kΩ R4 Susumu Co Ltd RR0816P-2493-D-39D
SMD
Capacitor, Tantalum 4.7µF 35V
51 4 4.7µF C1, C3, C9, C17 Vishay/Sprague 293D475X9035C2TE3
10% SMD
C2, C4, C10, Capacitor, Ceramic 1 µF 25V Y5V Murata Electronics
6 4 1µF GRM188F51E105ZA12D
C18 0603 North America
Capacitor, .10µF 25V Ceramic
7 10 0.1µF C5-C8, C11-C16 Kemet C0603C104Z3VACTU
Y5V 0603
Emulation
8 1 U1 Test Socket for 20-Pin QFN/MLF S-MLF-00-020-A
Technology, Inc.
Conn RCPT .100" 11POS GOLD
9 2 U2 T/H; See assembly drawing in Samtec Inc SS-111-G-2
Figure 29
10 1 U3 IC Buffer Schmitt Trig SOT235 Texas Instruments SN74LVC1G17DBVR
Term Block 3-Pos 5.08mm
11 1 T2 Tyco Electronics 1437671-4
SCREWLESS
Pin Socket
12 6 Pin Socket Rcpt .014-.026 30AU AMP 5050863-5
(R1-R3)
Conn Header 1POS .100" SGL
13 8 TP Cut to Size Test Points, All Samtec TSW-132-07-G-S
Gold
Standoffs, Hex , 4-40 Threaded,
14 4 Standoff None 0.500" length, 0.250" OD, Keystone 2203
Aluminum Iridite Finish
15 4 Screw none Screw Machine Phil 4-40X1/4 SS Building Fasteners PMSSS 440 0025 PH
Conn Header 3POS .100" SGL
16 5 Cut to Size JMP1-JMP6 Samtec TSW-132-07-G-S
Gold
17 5 N/A Shunt LP W/Handle 2-Pos 30AU AMP/Tyco Electronics 881545-2
18 1 BUF08630 U1 20-Pin QFN Texas Instruments BUF08630
29
SBOU091–September 2010 BUF08630EVM User Guide and Software Tutorial
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