Datasheet

bq76925
SLUSAM9B –JULY 2011– REVISED DECEMBER 2011 www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
RANGE
(2)
MIN MAX UNITS
Supply
V
BAT
voltage BAT –0.3 36 V
range
Cell input differential, VCn to VCn+1, n = 0 to 5 –0.3 9
Cell input, VCn, n = 1 to 6 –0.3 (6 × n)
Input
BAT to VC6 differential –10 10
V
I
voltage V
VC0
(3)
–3 3
range
SENSEP, SENSEN –3 3
SCL, SDA –0.3 6
VCOUT, VIOUT, VREF –0.3 3.6
Output
VTB, V3P3 –0.3 7
V
O
voltage V
ALERT –0.3 30
range
VCTL –0.3 36
I
CB
Cell balancing current 70 mA
I
IN
Cell input current –25 70 mA
T
STG
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating
Conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltages are relative to VSS, except “Cell input differential.”
(3) Negative voltage swings on VC0 in the absolute maximum range can cause unwanted circuit behavior and should be avoided.
THERMAL INFORMATION
bq76925
TSSOP QFN
THERMAL METRIC
(1)
UNITS
(PW PACKAGE) (RGE PACKAGE)
(20) PINS (24) PINS
θ
JA
Junction-to-ambient thermal resistance 97.5 36.0
θ
JC (top)
Junction-to-case (top) thermal resistance 31.7 38.6
θ
JB
Junction-to-board thermal resistance 48.4 14.0
°C/W
ψ
JT
Junction-to-top characterization parameter 1.5 0.6
ψ
JB
Junction-to-board characterization parameter 47.9 14.0
θ
JC (bottom)
Junction-to-case (bottom) thermal resistance n/a 4.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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