Datasheet

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23 Top Silkscreen Layer ..................................................................................................... 38
24 Top Copper Layer ......................................................................................................... 39
25 Inner Copper Layer........................................................................................................ 39
26 Inner Copper Layer........................................................................................................ 40
27 Bottom Copper Layer ..................................................................................................... 40
28 Drill Drawing................................................................................................................ 41
List of Tables
1 Cell Voltage Connections .................................................................................................. 7
2 USB Interface Connection ................................................................................................. 7
3 JTAG Interface Connection................................................................................................ 8
4 Pack Status Connection.................................................................................................... 8
5 J1, BAT Pin Circuit Configuration......................................................................................... 8
6 J2, VCTL Pin Circuit Configuration ...................................................................................... 8
7 J3, V3P3 Pin Circuit Configuration ....................................................................................... 9
8 J4, V3P3 Pin Capacitor Circuit Configuration ........................................................................... 9
9 J5, SENSEP Pin Circuit Configuration ................................................................................... 9
10 J6, DVCC Pin Circuit Configuration ...................................................................................... 9
11 DIP Switch, S4 .............................................................................................................. 9
12 DIP Switch, S2............................................................................................................. 10
13 Test Points ................................................................................................................. 10
14 Circuit Configuration ...................................................................................................... 12
15 Default Register Values .................................................................................................. 18
16 Formulas to Convert VCOUT to either °C or mV...................................................................... 23
17 Example Log File .......................................................................................................... 26
18 Example of a Device Connect Command .............................................................................. 28
19 Data From MSP430F2122 ............................................................................................... 29
20 Example of a Device Connect Command .............................................................................. 30
21 Bill of Materials............................................................................................................. 37
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SLUU514–July 2011 bq76925EVM Evaluation Module
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