Datasheet

bq51011
bq51013
SLVSAT9D –APRIL 2011–REVISED AUGUST 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
Ordering Number
Part NO Marking Function Package Quantity
(Tape and Reel)
bq51013YFFR 3000
bq51013 DSBGA-YFF
bq51013YFFT 250
bq51013 5V Regulated Power Supply
bq51013RHLR 3000
WAES QFN-RHL
(1)
bq51013RHLT 250
bq51011YFFR 3000
bq51011 bq51011 Current Limited Power Supply DSBGA-YFF
bq51011YFFT 250
(1) Product Preview
AVAILABLE OPTIONS
Communication
Device Function V
AD_OVP
V
RECT-OVP
V
RECT(REG)
V
OUT(REG)
Current Limit
bq51013 5V Power Supply 15V Dynamic 5V None
none
5V Current Limited 400mA + Dynamic
bq51011 15V Tracks V
OUT
5V
Power Supply I
Lim
ABSOLUTE MAXIMUM RATINGS
(1)(2)
over operating free-air temperature range (unless otherwise noted)
VALUES
PARAMETER PIN UNITS
MIN MAX
AC1, AC2, RECT, COMM1, COMM2, OUT, V
-0.3 20
CHG
Input Voltage
AD, AD-EN -0.3 30 V
BOOT1, BOOT2 -0.3 26 V
Input Current AC1, AC2 1 A(RMS)
Output Current OUT 1.5 A
CHG 15 mA
Output Sink Current
COMM1, COMM2 1 A
Junction temperature, T
J
-40 150 °C
Storage temperature, T
STG
-65 150 °C
ESD Rating (HBM) (100pF, 1.5KΩ) All 2KV
(1) All voltages are with respect to the VSS terminal, unless otherwise noted.
(2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
RHL YFF
THERMAL METRIC
(1)
UNITS
20 PiNS 28 PINS
θ
JA
Junction-to-ambient thermal resistance 37.7 58.9
θ
JCtop
Junction-to-case (top) thermal resistance 35.5 0.2
θ
JB
Junction-to-board thermal resistance 13.6 9.1
°C/W
ψ
JT
Junction-to-top characterization parameter 0.5 1.4
ψ
JB
Junction-to-board characterization parameter 13.5 8.9
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.7 n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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