Datasheet

bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
SLUSAJ3C –SEPTEMBER 2011–REVISED MAY 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
PACKAGE TAPE AND REEL TAPE AND REEL
T
A
PART NUMBER PACKAGE OVP (V) DELAY TIME (S)
DESIGNATOR (LARGE) (SMALL)
bq294502 4.35 4.0 bq294502DRVR bq294502DRVT
bq294504 4.35 6.5 bq294504DRVR bq294504DRVT
bq294512 4.40 4.0 bq294512DRVR bq294512DRVT
bq294515 4.425 4.0 bq294515DRVR bq294515DRVT
bq294522 4.45 4.0 bq294522DRVR bq294522DRVT
bq294524 4.45 6.5 bq294524DRVR bq294524DRVT
–40°C to
SON-6 DRV
110°C
bq294532 4.50 4.0 bq294532DRVR bq294532DRVT
bq294562 4.25 4.0 bq294562DRVR bq294562DRVT
bq294572 4.00 4.0 bq294572DRVR bq294572DRVT
bq294582 4.225 4.0 bq294582DRVR bq294582DRVT
bq294584
(2)
4.225 6.5 bq294584DRVR bq294584DRVT
bq294592 4.30 4.0 bq294592DRVR bq294592DRVT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on ti.com (www.ti.com).
(2) Product Preview only
THERMAL INFORMATION
bq2945xy
THERMAL METRIC
(1)
SON UNITS
6 PINS
θ
JA
Junction-to-ambient thermal resistance 186.4
θ
JC(top)
Junction-to-case(top) thermal resistance 90.4
θ
JB
Junction-to-board thermal resistance 110.7
°C/W
ψ
JT
Junction-to-top characterization parameter 96.7
ψ
JB
Junction-to-board characterization parameter 90
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592