Datasheet

www.ti.com
TYPICAL APPLICATION
UDG−04096
+
PACK−
PACK+
HDQ
ESD Protection
D2
5.6 V
R7
100
R8
100
R1
1 k
C1
0.1 µF
R2
1 k
R
S
0.02
R4
10 k
C2
0.1 µF
C3
0.1 µF
C4
0.1 µF
C3
0.1 µF
R3
1 k
Li-Ion Protector
Li-Ion
or
Li-Pol
PGM TP
1
2
3
4
9
8
7
6
GPIO
SRP
SRN
BAT
RBI
VCC
VSS
D/C
bq27000DRK
5 HDQ
10PGM
11
ABSOLUTE MAXIMUM RATINGS
bq27000 , bq27200
SLUS556D SEPTEMBER 2004 REVISED MARCH 2006
ORDERING INFORMATION
TA COMMUNICATION INTERFACE PACKAGED DEVICES
(1)
MARKINGS
HDQ bq27000DRKR 27000
-20 ° C to 70 ° C
I
2
C bq27200DRKR 27200
(1) The DRK package is available taped and reeled only. Quantities are 2,000 devices per reel.
over operating free-air temperature range (unless otherwise noted)
bq27000
UNITS
bq27200
V
CC
Supply voltage (with respect to V
SS
) -0.3 to 7
-0.3 to
SRP, SRN, RBI, BAT (all with respect to V
SS
)
V
CC
+0.3
V
HDQ, SCL, SDA, GPIO (all with respect to
V
IN
Input voltage -0.3 to 7
V
SS
)
PGM (with respect to V
SS
) during EEPROM
-0.3 to 22
programming
I
SINK
Output sink current GPIO, SCL, SDA, HDQ 5 mA
T
A
Operating free-air temperature range -20 to 70
T
stg
Storage temperature range -65 to 150
° C
T
J
Operating junction temperature range -40 to 125
Lead temperature (soldering, 10 sec) 300
2
Submit Documentation Feedback