Datasheet

bq27530-G1
www.ti.com SLUSAL5 –DECEMBER 2012
DEVICE INFORMATION
AVAILABLE OPTIONS
FIRMWARE COMMUNICATION TAPE and REEL
PART NUMBER PACKAGE
(2)
T
A
VERSION
(1)
FORMAT QUANTITY
bq27530YZFR-G1 3000
1.04
CSP-15 –40°C to 85°C
I
2
C
(0x0104)
bq27530YZFT-G1 250
(1) Refer to the FW_VERSION subcommand to confirm the firmware version.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
THERMAL INFORMATION
bq27530-G1
THERMAL METRIC
(1)
UNITS
YZF(15 PINS)
θ
JA
Junction-to-ambient thermal resistance 70
θ
JCtop
Junction-to-case (top) thermal resistance 17
θ
JB
Junction-to-board thermal resistance 20
°C/W
ψ
JT
Junction-to-top characterization parameter 1
ψ
JB
Junction-to-board characterization parameter 18
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
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