Datasheet

Not Recommended for New Designs
bq27505
www.ti.com SLUS884–FEBRUARY 2009
2 DEVICE INFORMATION
2.1 AVAILABLE OPTIONS
FIRMWARE TAPE and REEL
PART NUMBER PACKAGE
(1)
T
A
COMMUNICATION FORMAT
VERSION QUANTITY
bq27505YZGR-J1 3000
2.07 CSP-12 –40°C to 85°C
I
2
C
bq27505YZGT-J1 250
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2.2 DISSIPATION RATINGS
POWER RATING DERATING FACTOR
PACKAGE THERMAL RESISTANCE
(1) (2)
T
A
= 25°C ABOVE
(1) (2)
T
A
= 25°C
YZG q
JA
= 89°C/W q
JB
= 35°C/W 1.1 W 12 mW/°C
(1) Measured with high-K board.
(2) Maximum power dissipation is a function of T
J(max)
, q
JA
and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (T
J(max)
– T
A
)/ q
JA
.
Copyright © 2009, Texas Instruments Incorporated DEVICE INFORMATION 3
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