Datasheet

Not Recommended for New Designs
bq27505
SLUS884–FEBRUARY 2009 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1 INTRODUCTION ......................................... 1
4.3 MANUFACTURER INFORMATION BLOCKS ...... 20
1.1 FEATURES .......................................... 1
4.4 ACCESS MODES .................................. 21
1.2 APPLICATIONS ...................................... 1
4.5 SEALING/UNSEALING DATA FLASH ............. 21
1.3 DESCRIPTION ....................................... 1
4.6 DATA FLASH SUMMARY .......................... 21
2 DEVICE INFORMATION ................................ 3
5 FUNCTIONAL DESCRIPTION ........................ 23
2.1 AVAILABLE OPTIONS ............................... 3
5.1 FUEL GAUGING ................................... 23
2.2 DISSIPATION RATINGS ............................ 3 5.2 IMPEDANCE TRACK™ VARIABLES .............. 24
5.3 DETAILED PIN DESCRIPTION .................... 26
2.3 PIN ASSIGNMENT .................................. 4
3 ELECTRICAL SPECIFICATIONS ..................... 5 5.4 TEMPERATURE MEASUREMENT ................ 30
5.5 OVERTEMPERATURE INDICATION .............. 30
3.1 ABSOLUTE MAXIMUM RATINGS .................. 5
5.6 CHARGING AND CHARGE-TERMINATION
3.2 RECOMMENDED OPERATING CONDITIONS ..... 5
INDICATION ........................................ 30
3.3 POWER-ON RESET ................................. 6
5.7 POWER MODES ................................... 31
3.4 INTERNAL TEMPERATURE SENSOR
5.8 POWER CONTROL ................................ 32
CHARACTERISTICS ................................ 6
5.9 AUTOCALIBRATION ............................... 33
3.5 HIGH-FREQUENCY OSCILLATOR ................. 6
6 APPLICATION-SPECIFIC INFORMATION ......... 33
3.6 LOW-FREQUENCY OSCILLATOR .................. 6
6.1 BATTERY PROFILE STORAGE AND SELECTION
3.7 INTEGRATING ADC (COULOMB COUNTER) ...................................................... 33
6.2 APPLICATION-SPECIFIC FLOW AND CONTROL
CHARACTERISTICS ................................ 6
3.8 ADC (TEMPERATURE AND CELL ...................................................... 34
MEASUREMENT) CHARACTERISTICS ............ 7
7 COMMUNICATIONS
3.9 DATA FLASH MEMORY CHARACTERISTICS ..... 7
7.1 I
2
C INTERFACE
3.10 I
2
C-COMPATIBLE INTERFACE COMMUNICATION
7.2 I
2
C Time Out
TIMING CHARACTERISTICS ....................... 8
7.3 I
2
C Command Waiting time
4 GENERAL DESCRIPTION ............................. 9
7.4 PACKAGE INFORMATION
4.1 DATA COMMANDS ................................ 10
8 REFERENCE SCHEMATICS
4.2 DATA FLASH INTERFACE ........................ 19
8.1 SCHEMATIC
2 Contents Copyright © 2009, Texas Instruments Incorporated
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