Datasheet
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ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
STANDARD SERIAL COMMUNICATION (SDQ) TIMING
bq26100
SLUS696A – JUNE 2006 – REVISED FEBRUARY 2007
ORDERING INFORMATION
(1)
T
A
PACKAGE PART NUMBER
–40 ° C to 85 ° C 6-lead SON bq26100DRP
(1) For the most current package and ordiering information, see the Package Option Addendum at the
end of this document, or see the TI Web site at www.ti.com.
VALUE UNIT
Supply voltage (SDQ all with respect to VSS) –0.3 to 7.7 V
Output current (SDQ) 5 mA
T
A
Operating free-air temperature range –40 to 85 ° C
T
stg
Storage temperature range –65 to 150 ° C
T
J
Junction temperature range –40 to 90 ° C
Lead temperature (Soldering, 10 sec) 300 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
sdq
Pull-up voltage 2.5 5.0 V
T
J
Operating free-air temperature range –40 85 ° C
all parameters over operating free-air temperature and supply voltage range (unless otherwise noted) (memory programming
and authentication were tested with R1 = 4.7 k Ω , C1 = 0.1 µ F over pull-up voltage range)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Power up communication delay Power capacitor charge time 100 ms
I
sleep
Sleep current 8 11 µ A
I
sdq(Vsdq)
V
sdq
Current V
sdq
≥ V
sdq(min)
50 µ A
OTP Memory programming voltage 6.8 7 7.7 V
OTP Memory programming time 100 µ s/byte
EEPROM Programming current (peak current) 83 µ A
EEPROM Peak current duration 100 µ s
EEPROM Programming time 50 ms
SDQ
V
IL
Input low-level voltage 0.63 V
I
OL
Output low sink current V
OL
= 0.4 V 1 mA
over recommended operating temperature and supply voltage range (unless otherwise noted) (See Figure 1 )
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
RSTL
Reset time – low 480 µ s
t
RSTH
Reset time – high 480 µ s
t
PDL
Presence detect – low 60 240 µ s
t
PDH
Presence detect – high 15 60 µ s
t
REC
Recovery time 1 µ s
2
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