Datasheet

Bill of Materials, Board Layout and Schematics
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5 Bill of Materials, Board Layout and Schematics
5.1 Bill of Materials
Table 2. Bill of Materials
Count RefDes Value Description Size Part Number MFR
2 C1, C2** 4.7uF Capacitor, Ceramic, 10V, X5R, 10% 0805 GRM219R61A475KE19D Murata
1 C3** 100uF Capacitor, Ceramic, 6.3V, X5R, 20% 1812 GRM43SR60J107ME20L Murata
2 C4, C6 0.1uF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std
1 C5** 0.01uF Capacitor, Ceramic, 50V, X7R, 10% 0603 GRM188R71H103KA01D Murata
3 J1, J2, J5 ED555/2DS Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 ED555/2DS OST
inch
2 J3, J4 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins
1 J6 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins
2 JP1, JP2 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins
1 L1 22uH Inductor, SMT, 0.8A, 360milliohm 0.153 x 0.153 LPS4018-223MLB Coilcraft
inch
1 R1 10.0M Resistor, Chip, 1/10W, 1% 0805 CRCW080510M0FKEA Vishay
0 R11 Open Resistor, Chip, 1/10W, 1% 0805 Std Std
4 R12, R14, R15, 0 Resistor, Chip, 1/10W, 1% 0805 Std STD
R16
0 R13, R17, R18 Open Potentiometer, 1/4 in. Cermet, 12-Turn, 0.25x0.17 3266W-504LF Bourns
Top-Adjust
3 R2, R6, R8 4.42M Resistor, Chip, 1/10W, 1% 0805 CRCW08054M42FKEA Vishay
1 R3 5.90M Resistor, Chip, 1/10W, 1% 0805 CRCW08055M90FKEA Vishay
1 R4 4.02M Resistor, Chip, 1/10W, 1% 0805 CRCW08054M02FKEA Vishay
2 R5, R10 5.60M Resistor, Chip, 1/10W, 1% 0805 CRCW08055M60FKEA Vishay
1 R7 1.43M Resistor, Chip, 1/10W, 1% 0805 CRCW08051M43FKEA Vishay
1 R9 4.22M Resistor, Chip, 1/10W, 1% 0805 CRCW08054M22FKEA Vishay
0 TP1, TP2, TP6, Open Test Point, O.032 Hole STD STD
TP7, TP8, TP9,
TP10, TP14,
TP16, TPG1,
TPG2, TPG3,
TPG4
1 U1 BQ25504RGT IC, NanoAmpere Integrated Boost QFN-16 BQ25504RGT TI
Converter/Charger
1 -- PCB, 1.8 In x 1.8 In x 0.031 In HPA674 Any
2 See Note 5 Shunt, 100-mil, Black 0.1 929950-00 3M
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
5. Place shunt on JP1-2/3 (Divider) and JP2 (place on just one pin ckt should be floating).
12
bq25504 EVM Ultra Low Power Boost Converter with Battery Management for SLUU654AOctober 2011Revised October 2011
Energy Harvester Applications
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