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Printed-Circuit-Board Layout Guideline

6. The output capacitor ground connections need to be tied to the same copper that connects to the

input capacitor ground before connecting to the system ground.

7. Use single ground connection to tie the charger power ground to the charger analog ground. Just

beneath the IC, use analog ground copper pour, but avoid the power pins in order to reduce inductive

and capacitive noise coupling.

8. Route the analog ground separately from the power ground. Connect the analog ground, and then

connect the power ground separately. Connect analog ground and power ground together using power

pad as the single ground connection point. Or use a 0-Ω resistor to tie analog ground to the power

ground. (The power pad must tie to the analog ground in this case, if possible).

9. Place the decoupling capacitors next to the IC pins, and make the trace connection as short as

possible.

10. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB

ground. Ensure that sufficient thermal vias are located directly under the IC, connecting to the ground

plane on the other layers.

SLUU507A–June 2011–Revised September 2011 bq24735/725A Battery Charger Evaluation Module

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