Datasheet

Not Recommended for New Designs

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SLUS702A –JULY 2010–REVISED NOVEMBER 2010

PIN FUNCTIONS – 20-PIN QFN (continued)

PIN FUNCTION DESCRIPTION

NO. NAME

13 SRP Charge current sense resistor positive input. Connect the SRP pin to a 10Ω resistor first then from resistor another

terminal connect to current sensing resistor. Connect a 0.1µF ceramic capacitor between current sensing resistor to

provide differential mode filtering. See the application information about negative output voltage protection for hard

shorts on battery to ground or battery reverse connection by adding small resistor.

14 GND IC ground. On PCB layout, connect to analog ground plane, and only connect to power ground plane through the power

pad underneath IC.

15 LODRV Low side power MOSFET driver output. Connect to low side n-channel MOSFET gate.

16 REGN Linear regulator output. REGN is the output of the 6V linear regulator supplied from VCC. The LDO is active when

voltage on ACDET pin is above 0.6V and voltage on VCC is above UVLO. Connect a 1µF ceramic capacitor from

REGN to GND.

17 BTST High side power MOSFET driver power supply. Connect a 0.047µF capacitor from BTST to PHASE, and a bootstrap

Schottky diode from REGN to BTST.

18 HIDRV High side power MOSFET driver output. Connect to the high side n-channel MOSFET gate.

19 PHASE High side power MOSFET driver source. Connect to the source of the high side n-channel MOSFET.

20 VCC Input supply, diode OR from adapter or battery voltage. Use 10Ω resistor and 1µF capacitor to ground as low pass filter

to limit inrush current.

Exposed pad beneath the IC. Analog ground and power ground star-connected only at the PowerPAD plane. Always

PowerPAD™ solder PowerPAD to the board, and have vias on the PowerPAD plane connecting to analog ground and power ground

planes. It also serves as a thermal pad to dissipate the heat.

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