Datasheet

bq24650
www.ti.com SLUSA75 –JULY 2010
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)(2)(3)
VALUE UNIT
VCC, STAT1, STAT2, SRP, SRN –0.3 to 33
PH –2 to 36
VFB –0.3 to 16
Voltage range (with respect to GND) V
REGN, LODRV, TS, MPPSET, TERM_EN –0.3 to 7
BTST, HIDRV with respect to GND –0.3 to 39
VREF –0.3 to 3.6
Maximum difference voltage SRP–SRN –0.5 to 0.5 V
Junction temperature range, T
J
–40 to 155 °C
Storage temperature range, T
stg
–55 to 155 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
(3) Must have a series resistor between battery pack to VFB if battery pack voltage is expected to be greater than 16V. Usually the resistor
divider top resistor takes care of this.
THERMAL INFORMATION
bq24650
THERMAL METRIC
(1)
QFN UNITS
16 PINS
q
JA
Junction-to-ambient thermal resistance
(2)
43.8
y
JT
Junction-to-top characterization parameter
(3)
0.6 °C/W
y
JB
Junction-to-board characterization parameter
(4)
15.77
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-top characterization parameter, y
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(4) The junction-to-board characterization parameter, y
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
VALUE UNIT
VCC, STAT1, STAT2, SRP, SRN –0.3 to 28
PH –2 to 30
VFB –0.3 to 14
Voltage range (with respect to GND) V
REGN, LODRV, TS, MPPSET, TERM_EN –0.3 to 6.5
BTST, HIDRV with respect to GND –0.3 to 34
VREF 3.3
Maximum difference voltage SRP–SRN –0.2 to 0.2 V
Junction temperature range, T
J
–40 to 125 °C
Storage temperature range, T
stg
–55 to 155 °C
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