Datasheet

bq24630
www.ti.com SLUS894A –JANUARY 2010– REVISED OCTOBER 2011
ORDERING INFORMATION
ODERING NUMBER
PART NUMBER IC MARING PACKAGE QUANTITY
(Tape and Reel)
bq24630RGER 3000
24-Pin 4-mm × 4-mm
bq24630 OAT
QFN
bq24630RGET 250
THERMAL INFORMATION
bq24630
THERMAL METRIC
(1)
RGE UNIT
24 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
43 °C/W
θ
JCtop
Junction-to-case (top) thermal resistance
(3)
54.3 °C/W
θ
JB
Junction-to-board thermal resistance
(4)
20 °C/W
ψ
JT
Junction-to-top characterization parameter
(5)
0.6 °C/W
ψ
JB
Junction-to-board characterization parameter
(6)
19 °C/W
θ
JCbot
Junction-to-case (bottom) thermal resistance
(7)
4 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
ABSOLUTE MAXIMUM RATINGS
(1) (2) (3)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
Voltage range VCC, ACP, ACN, SRP, SRN, BATDRV, ACDRV, CE, STAT1, –0.3 to 33 V
STAT2, PG
PH –2 to 36 V
VFB –0.3 to 16 V
REGN, LODRV, ACSET, TS, TTC –0.3 to 7 V
BTST, HIDRV with respect to GND –0.3 to 39 V
VREF, ISET1, ISET2 –0.3 to 3.6 V
Maximum difference voltage ACP–ACN, SRP–SRN –0.5 to 0.5 V
Junction temperature range, T
J
–40 to 155 °C
Storage temperature range, T
stg
–55 to 155 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
(3) Must have a series resistor between battery pack to VFB if Battery Pack voltage is expected to be greater than 16 V. Usually, the
resistor divider top resistor takes care of this.
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