Datasheet

CurrentDirection
ToSRP -SRNpinor ACP - ACNpin
R
SNS
CurrentSensingDirection
High
Frequency
Current
Path
L1
R1
C3
C1
C2
PGND
SW
V
BAT
BAT
V
IN
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SLUS892B –DECEMBER 2009–REVISED SEPTEMBER 2013 www.ti.com
connection point. Or use a 0-Ω resistor to tie analog ground to power ground (thermal pad should tie to
analog ground in this case). A star connection under the thermal pad is highly recommended.
8. It is critical that the exposed thermal pad on the back side of the IC package be soldered to the PCB ground.
Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground plane on the
other layers.
9. Place decoupling capacitors next to the IC pins and make trace connection as short as possible.
10. Size and number of all vias should be enough for a given current path.
Figure 22. High-Frequency Current Path
Figure 23. Sensing Resistor PCB Layout
See the EVM design (SLUU396) for the recommended component placement with trace and via locations.
For the QFN information, see SCBA017 and SLUA271.
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