Datasheet

bq24610
bq24617
www.ti.com SLUS892B –DECEMBER 2009–REVISED SEPTEMBER 2013
THERMAL INFORMATION
bq24610 bq24617
THERMAL METRIC
(1)
RGE RGE UNITS
24 PINS 24 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
43 43 °C/W
θ
JCtop
Junction-to-case (top) thermal resistance
(3)
54.3 54.3 °C/W
θ
JB
Junction-to-board thermal resistance
(4)
20 20 °C/W°
ψ
JT
Junction-to-top characterization parameter
(5)
0.6 0.6 °C/W
ψ
JB
Junction-to-board characterization parameter
(6)
19 19 °C/W
θ
JCbot
Junction-to-case (bottom) thermal resistance
(7)
4 4 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
VALUE UNIT
VCC, ACP, ACN, SRP, SRN, BATDRV, ACDRV, CE, STAT1, STAT2, PG –0.3 to 33 V
PH –2 to 36 V
VFB –0.3 to 16 V
Voltage range
REGN, LODRV, ACSET, TS, TTC –0.3 to 7 V
BTST, HIDRV with respect to GND –0.3 to 39 V
VREF, ISET1, ISET2 –0.3 to 3.6 V
Maximum difference ACP–ACN, SRP–SRN –0.5 to 0.5 V
voltage
T
J
Junction temperature range –40 to 155 °C
T
stg
Storage temperature range –55 to 155 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
(3) Must have a series resistor between battery pack to VFB if battery-pack voltage is expected to be greater than 16 V. Usually the
resistor-divider top resistor takes care of this.
RECOMMENDED OPERATING CONDITIONS
VALUE UNIT
VCC, ACP, ACN, SRP, SRN, BATDRV, ACDRV, CE, STAT1, STAT2, PG –0.3 to 28 V
PH –2 to 30 V
VFB –0.3 to 14 V
Voltage range REGN, LODRV, ACSET, TS, TTC –0.3 to 6.5 V
BTST, HIDRV with respect to GND –0.3 to 34 V
ISET1, ISET2 –0.3 to 3.3 V
VREF 3.3 V
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