Datasheet
bq24272
www.ti.com
SLUSB09 –JUNE 2012
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
NTC MONITORING
PART NUMBER OVP JEITA COMPATIBLE MINIMUM SYSTEM VOLTAGE PACKAGE
(TS)
bq24272YFFR 10.5 V Yes No 3.5 V WCSP
bq24272YFFT 10.5 V Yes No 3.5 V WCSP
bq24272RGER 10.5 V Yes No 3.5 V QFN
bq24272RGET 10.5 V Yes No 3.5 V QFN
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
IN –2 20 V
BYP, PMID, BOOT –0.3 20 V
Pin voltage range (with
respect to VSS)
SW –0.7 12 V
SYS, BAT, BGATE, DRV, STAT, INT, SDA, SCL, CD, TS –0.3 7 V
BOOT to SW –0.3 7 V
SW 4.5 A
Output Current (Continuous)
SYS 3.5 a
Input Current (Continuous) IN 2.75 A
Output Sink Current STAT, INT 10 mA
Operating free-air temperature range –40 85 °C
Junction temperature, T
J
–40 125 °C
Storage temperature, T
STG
–65 150 °C
Lead temperature (soldering, 10 s) 300 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
THERMAL INFORMATION
bq24272
THERMAL METRIC
(1)
UNITS
49 PINS (YFF) 24 PINS (QFN)
θ
JA
Junction-to-ambient thermal resistance 49.8 32.6
θ
JCtop
Junction-to-case (top) thermal resistance 0.2 30.5
θ
JB
Junction-to-board thermal resistance 1.1 3.3
°C/W
ψ
JT
Junction-to-top characterization parameter 1.1 0.4
ψ
JB
Junction-to-board characterization parameter 6.6 9.3
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a 2.6
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(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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