Datasheet

D
E
TI YMLLLLS
bq24272
CHIP SCALE PACKAGING DIMENSIONS
PGNDPGNDPGNDIN
BYPBYPBYPPMIDI
SWSWSWSW
PGNDPGNDPGND
SW
SDA
PGND
BOOT
CD
IN
PMIDI
PGND
SCL
1 2 3 4 5
A
B
C
D
E
IN
SW
PMIDI
PGND
6
BGATE DRVSYSSYS INT
F
SYS
IN
SW
PGND
PMIDI
PGND
SYS
TS PGNDBATBAT STATBATBAT
G
7
N.C. N.C.
0-Pin A1 Marker, TI-TI Letters, YM- Year Month Date Code,
LLLL-Lot Trace Code, S-Assembly Site Code
The bq2427x devices are available in a 49-bump chip scale package (YFF, NanoFree ). The package dimensions are:
TM
D – 2.78 mm 0.05 mm
E – 2.78 mm 0.05 mm
±
±
IN
PMID
GND
BYP
BOOT
SW
SYS
SYS
BAT
PGND
SW
BYP
GND
PMID
IN
BOOT
SW
SYS
PGND
SYS
BAT
WCSP I2C PART
QFN I2C PART
bq24272
SLUSB09 –JUNE 2012 www.ti.com
Sample Layout
Package Summary
24 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :bq24272