Datasheet

bq24165
bq24166
bq24167
www.ti.com SLUSAP4B –DECEMBER 2011–REVISED MARCH 2013
PIN FUNCTIONS (continued)
PIN NUMBER
PIN
bq24165 bq24166/7 I/O DESCRIPTION
NAME
YFF RGE YFF RGE
Gate Drive Supply. DRV is the bias supply for the gate drive of the internal
MOSFETs. bypass DRV to PGND with a 1μF ceramic capacitor. DRV may be
DRV F7 6 F7 6 O
used to drive external loads up to 10mA. DRV is active whenever the input is
connected and V
SUPPLY
> V
UVLO
and V
SUPPLY
> (V
BAT
+ V
SLP
)
Battery Connection. Connect to the positive terminal of the battery.
BAT G1–G4 11, 12 G1–G4 11, 12 I/O
Additionally, bypass BAT to GND with at least a 1μF capacitor.
Battery Pack NTC Monitor. Connect TS to the center tap of a resistor divider
from DRV to GND. The NTC is connected from TS to GND. The TS function
in the bq24166 provides 2 thresholds for Hot/ Cold shutoff, while the bq24167
TS – – G5 9 I
has 2 additional thresholds for JEITA compliance. See the NTC Monitor
section for more details on operation and selecting the resistor values.
Connect TS to DRV to disable the TS function.
Charge Status Open Drain Output. CHG is pulled low when a charge cycle
starts and remains low while charging. CHG is high impedance when the
CHG G6 8 G6 8 O
charging terminates and when no supply exists. CHG does not indicate
recharge cycles.
Charge Current Programming Input. Connect a resistor from ISET to GND to
ISET G7 5 G7 5 I program the fast charge current. The charge current is programmable from
550mA to 2.5A.
There is an internal electrical connection between the exposed thermal pad
and the PGND pin of the device. The thermal pad must be connected to the
Thermal
– Pad – Pad – same potential as the PGND pin on the printed circuit board. Do not use the
Pad
thermal pad as the primary ground input for the device. PGND pin must be
connected to ground at all times.
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