Datasheet

WCSP PACKAGE
(Top View)
CHIP SCALE PACKAGE
(Top Side Symbol For bq24165)
TIYMLLLLS
bq24165
O - Pin A1 Marker
TI -Texas Instruments Letters
YM - Year Month Date Code
LLLL - Lot Trace Code
S - Assembly Site Code
The bq2416x devices are available in a 49-bump chip scale package (YFF, NanoFree ).
The package dimensions are:
TM
· ±
· ±
D = 2.78mm 0.05mm
E = 2.78mm 0.05mm
CHIP SCALE PACKAGING DIMENSIONS
1
2
3
4
5
A B
C
D E
6
F
G
7
E
D
bq24165
bq24166
bq24167
www.ti.com SLUSAP4B –DECEMBER 2011–REVISED MARCH 2013
PACKAGE SUMMARY
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Product Folder Links: bq24165 bq24166 bq24167