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PCB Laout Guideline
3 PCB Laout Guideline
1. It is critical that the exposed thermal pad on the backside of the BQ24130 package be soldered to the
PCB ground. Make sure there are sufficient thermal vias right underneath the IC, connecting to the
ground plane on the other layers.
2. The control stage and the power stage should be routed separately. At each layer, the signal ground
and the power ground are connected only at the thermal pad.
3. Charge current sense resistor must be connected to SRP, SRN with a Kelvin contact. The area of this
loop must be minimized. The decoupling capacitors for these pins should be placed as close to the IC
as possible.
4. Decoupling capacitors for VREF, AVCC, REGN should make the interconnections to the IC as short as
possible.
5. Decoupling capacitors for BAT must be placed close to the corresponding IC pins and make the
interconnections to the IC as short as possible.
6. Decoupling capacitor(s) for the charger input must be placed very close to SW and PGND.
7. Take the EVM layout for design reference.
4 Bill of Materials, Board Layouts and Schematics
4.1 Bill of Materials
Table 4. Bill of Materials
Count RefDes Value Description Size Part Number MFR
1 C1 2.2 µF Capacitor, Ceramic, 25V, X7R, 10% 805 STD STD
3 C11,C12, 0.1 µF Capacitor, Ceramic, 50V, X7R, 10% 603 STD STD
C17
0 C13 NONE Capacitor, Ceramic, 50V, X7R, 10% 603 STD STD
2 C14, C16 1.0 µF Capacitor, Ceramic, 16V, X7R, 10% 805 STD STD
0 C15 NONE Capacitor, Ceramic, 16V, X7R, 10% 805 STD STD
2 C2, C3 4.7 µF Capacitor, Ceramic, 25V, X7R, 10% 805 STD STD
2 C4, C10 1.0 µF Capacitor, Ceramic, 25V, X7R, 10% 805 STD STD
0 C5 NONE Capacitor, Ceramic, Low Inductance, 50V, X7R, 603 STD STD
10%
1 C6 47 nF Capacitor, Ceramic, 50V, X7R, 10% 603 STD STD
2 C7, C8 10 µF Capacitor, Ceramic, 25V, X7R, 10% 1206 STD STD
1 C9 1 µF Capacitor, Ceramic, 25V, X7R, 10% 805 STD STD
1 D1 PDS1040 Diode, Schottky Barrier, 10A, 40V Power DI 5 PDS1040-13 Diodes
1 D2 BAT54XV2T1G Diode, Schottky, 10 mA, 30 V SOD523 BAT54XV2T1G On Semi
0 D3 B220A Diode, Schottky, 20V, 2A SMA B220A-13-F Diodes
1 D4 Green Diode, LED, Green, 2.1V, 20mA, 6mcd 603 LTST-C190GKT Lite On
0 D5 BAT54XV2T1G Diode, Schottky, 10 mA, 30 V SOD523 BAT54XV2T1G On Semi
1 J1, J2 ED120/2DS Terminal Block, 2-pin, 15-A, 5.1mm 0.40 x 0.35 inch ED120/2DS OST
1 J3 ED555/3DS Terminal Block, 3-pin, 6-A, 3.5mm 0.41 x 0.25 inch ED555/3DS OST
3 JP2, JP4, PEC02SAAN Header, 2 pin, 100mil spacing 0.100 inch x 2 PEC02SAAN Sullins
JP5
2 JP1, JP3 PEC03SAAN Header, 3 pin, 100mil spacing 0.100 inch x 3 PEC03SAAN Sullins
1 L1 6.8uH Inductor, SMT, 8A, 21milliohm 0.400 x 0.453 inch HLP4040DZER6R8M01 Vishay
1 Q1 2N7002-7-F MOSFET, N-ch, 60V, 115mA, 1.2Ohms SOT23 2N7002-7-F Diodes Inc
2 R10, R14 0 Resistor, Chip, 1/16W, 1% 603 STD STD
1 R11 100 Resistor, Chip, 1/16W, 1% 603 STD STD
1 R12 30.1k Resistor, Chip, 1/16W, 1% 603 STD STD
2 R13, R5 10k Resistor, Chip, 1/16W, 1% 603 STD STD
1 R15 232k Resistor, Chip, 1/16W, 1% 603 STD STD
1 R16 154k Resistor, Chip, 1/16W, 1% 603 STD STD
7
SLVU495B–July 2011–Revised January 2012 600-kHz Synchronous Switch-Mode Li-Ion and Li-Polymer Host-Controlled
Battery Charger With Integrated MOSFETs
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