Datasheet
1
2
3
4
10
9
8
IN
GND
OUT
V
SS
STAT1
STAT2
7
6
GND
ISET
1.13k
R
W
SET
bq24080
+
PACK+
ChargeCurrent
TranslatorOutput
PACK–
C
0.1 F
1
m
C
0.1 F
2
m
VDC
GND
SOURCE
INPUT
CE
PG
1.5kW
1.5kW
1.5kW
5
P
TT
R
AJ
JA
-
=
q
P =(V -V )xI
(IN) (OUT) O(OUT)
bq24080
bq24081
www.ti.com
SLUS698E –MARCH 2006– REVISED AUGUST 2011
Figure 10. Typical Application Circuit
Thermal Considerations
The bq24080 and bq24081 are packaged in a thermally enhanced MLP package. The package includes a
thermal pad to provide an effective thermal contact between the device and the printed-circuit board (PCB). Full
PCB design guidelines for this package are provided in the application report entitled, QFN/SON PCB
Attachment (TI Literature Number SLUA271).
The most common measure of package thermal performance is thermal impedance (R
θJA
) measured (or
modeled) from the device junction to the air surrounding the package surface (ambient). The mathematical
expression for R
θJA
is:
(5)
Where:
• T
J
= device junction temperature
• T
A
= ambient temperature
• P = device power dissipation
Factors that can greatly influence the measurement and calculation of R
θJA
include:
• Orientation of the device (horizontal or vertical)
• Volume of the ambient air surrounding the device under test and airflow
• Whether other surfaces are in close proximity to the device being tested
• Use multiple 10–13 mil vias in the PowerPAD™ to copper ground plane.
• Avoid cutting the ground plane with a signal trace near the power IC.
• The PCB must be sized to have adequate surface area for heat dissipation.
• FR4 (figerglass) thickness should be minimized.
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal Power
FET. It can be calculated from the following equation:
(6)
Due to the charge profile of Li-xx batteries, the maximum power dissipation is typically seen at the beginning of
the charge cycle when the battery voltage is at its lowest. See Figure 6.
Copyright © 2006–2011, Texas Instruments Incorporated 17