Datasheet
SLUS025F − MAY 2001 − REVISED JULY 2002
20
www.ti.com
MECHANICAL DATA
Notes:
1.
Dimension
Inches Millimeters
Min. Max. Min. Max.
A
- 0.043 - 1.10
A1 0.002 0.006 0.05 0.15
B 0.007 0.012 0.18 0.30
C 0.004 0.007 0.09 0.18
D 0.1 14 0.122 2.90 3.10
E 0.169 0.176 4.30 4.48
e 0.0256BSC 0.65BSC
H 0.246 0.256 6.25 6.50
TS: 8−Pin TSSOP
8−Pin SOIC Narrow (SN)
8−Pin SN
(
0.150” SOIC
)
Dimension
Inches Millimeters
Min. Max. Min. Max.
A 0.060 0.070 1.52 1.78
A1 0.004 0.010 0.10 0.25
B 0.013 0.020 0.33 0.51
C 0.007 0.010 0.18 0.25
D 0.185 0.200 4.70 5.08
E 0.150 0.160 3.81 4.06
e 0.045 0.055 1.14 1.40
H 0.225 0.245 5.72 6.22
L 0.015 0.035 0.38 0.89
Controlling dimension: millimeters. Inches shown for reference only.
2 ’D’ and ’E’ do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0,15 mm per side
3 Each lead centerline shall be located within ±0,10 mm of its exact true position.
4 Leads shall be coplanar within 0,08 mm at the seating plane.
5 Dimension ’B’ does not include dambar protrusion. The dambar protrusion(s) shall not cause the lead width
to exceed ’B’ maximum by more than 0,08 mm.
6 Dimension applies to the flat section of the lead between 0,10 mm and 0,25 mm from the lead tip.
7 ’A1’ is defined as the distance from the seating plane to the lowest point of the package body (base plane).