Datasheet

Bill of Materials
2-7
Circuit Module
2.4 Bill of Materials
Table 2–1 lists the materials required for the bq2023EVM–002 circuit module
(SLUP143–001).
Table 2–1.Bill of Materials
Ref Des Qty-001 Description MFG MFG PART# Size
PCB 1 Printed-circuit board, .031, FR4,
SMOBC, HASL
Any SLUP143 Rev. A See FAB DWG
Terminal 4 Terminal block 3.5 mm On Shore
Technology
ED555/2DS
3.5 mm × 2
C1 1
Capacitor, ceramic, 1.0 µF, 16 V,
±10%, X7R
Panasonic ECJ–1VB1C104K 603
C2, C3, C4,
C5, C6, C7
6
Capacitor, ceramic, 0.1 µF, 16 V,
±10%, X7R
Panasonic ECJ–1VB1C104K 603
R8 1
Resistor, .020 Ω, 1/2 W, 1%
IRC LR2010–01–R020–F 2010
R7, R9, R10 3
Resistor, 100 kΩ, 1/16 W, 5%
Panasonic ERJ–3GSYJ104 603
R1, R2, R3,
R4, R5, R6
6
Resistor, 100 Ω, 1/16 W, 5%
Venkel ERJ–3GSYJ101 603
D1, D2, D3 3 Diode, Zener, 5.6 V Zetex BZX84C5V6 SOT–23
U1 1 Integrated circuit, battery monitor,
bq2023
Benchmarq/TI bq2023PW TSSOP–8
U2 1 Integrated circuit, charger
protection, UCC3952A –2
Unitrode/TI UCC3952AGSH–2 BCC–18
Component
count
27
Assembly Notes:
1) This assembly is ESD sensitive.
2) This assembly shall comply with IPC–A–610 class 2 or better.
3) This assembly must be free of flux residues and contaminants.
4) Use of no-clean flux is not acceptable.