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RF Expansion

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TPS75118

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BMP180

Pressure Sensor

RF Expansion

Connections

User

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User

Button

User

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ISL29023

Light Sensor

SHT21

Humidity Sensor

TMP006

Temp Sensor

MPU9150

9-axis Motion Sensor

1.6 in

2.0 in

User Manual

SPMU290–April 2013

BOOSTXL-SENSHUB Sensor Hub BoosterPack

The Sensor Hub Booster Pack (BOOSTXL-SENSHUB) is a low-cost extension board for the Tiva™ C

Series TM4C LaunchPad EK-TM4C123GXL evaluation platform for ARM

Cortex™-M4F-based

microcontrollers (MCUs). This extension board, or BoosterPack, is specifically designed to expand the

functionality of the Tiva TM4C LaunchPad. This user’s manual provides an overview of the Sensor Hub

BoosterPack software and hardware

Figure 1 shows a photo of the BOOST-XL-SENSHUB.

Figure 1. BOOSTXL-SENSHUB BoosterPack Extension Board

Contents

1 Board Overview ............................................................................................................. 2

2 Hardware Description ...................................................................................................... 3

3 Software Development ..................................................................................................... 5

4 References, PCB Layout, and Bill of Materials ......................................................................... 6

Tiva, Code Composer Studio are trademarks of Texas Instruments.

TivaWare, Stellaris are registered trademarks of Texas Instruments.

Cortex, Keil are trademarks of ARM Limited.

ARM, RealView are registered trademarks of ARM Limited.

Microsoft, Windows are registered trademarks of Microsoft Corp.

All other trademarks are the property of their respective owners.

SPMU290–April 2013 BOOSTXL-SENSHUB Sensor Hub BoosterPack

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Summary of content (14 pages)

PAGE 1
User Manual SPMU290 – April 2013 BOOSTXL-SENSHUB Sensor Hub BoosterPack The Sensor Hub Booster Pack (BOOSTXL-SENSHUB) is a low-cost extension board for the Tiva™ C Series TM4C LaunchPad EK-TM4C123GXL evaluation platform for ARM® Cortex™-M4F-based microcontrollers (MCUs). This extension board, or BoosterPack, is specifically designed to expand the functionality of the Tiva TM4C LaunchPad.
PAGE 2
Board Overview 1 www.ti.com Board Overview The Sensor Hub BoosterPack is an extension board for the TI MCU LaunchPad evaluation module ecosystem. It was designed specifically to extend the functionality of the Tiva TM4C1233 LaunchPad (EKTM4C123GXL). The Sensor Hub enables customers to create and model innovative prototype solutions that leverage the processing and floating-point capabilities of the TM4C123GH6PM MCU coupled with motion and environmental sensors.
PAGE 3
Hardware Description www.ti.com 1.3 Specifications Table 1 summarizes the specifications for the BOOSTXL-SENSHUB BoosterPack. Table 1. Sensor Hub BoosterPack Specifications 2 Parameter Value Board supply voltage 2.7 V to 5.5 V nominally supplied as 3.3 V from the BoosterPack interface Dimensions 2.0 x 1.5 x 0.625 (in) 5.08 x 3.81 x 1.587 (cm) RoHS status Compliant Hardware Description The Sensor Hub BoosterPack includes five motion and environmental sensors.
PAGE 4
Hardware Description 2.1 www.ti.com Functional Description This section provides a functional description of the Sensor Hub BoosterPack. 2.1.1 BoosterPack XL Connector The BoosterPack XL connector attaches the BoosterPack to the Tiva TM4C LaunchPad. This BoosterPack is specifically designed to match the pin function with the Tiva TM4C LaunchPad.
PAGE 5
Software Development www.ti.com 2.1.8 TPS75118 Voltage Regulator The TPS75118 regulates the 3.3-V supply from the LaunchPad down to 1.8 V for the input to the RF expansion connector. 3 Software Development This section provides general information on software development as well as instructions for Flash memory programming. Note: This information presumes that the Sensor Hub BoosterPack is connected to a Tiva TM4C1233 LaunchPad. 3.
PAGE 6
References, PCB Layout, and Bill of Materials www.ti.com 3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB port on the board. 4. Verify that the POWER LED D4 on the board is lit. 5. Run the LM Flash Programmer program. 6. In the Configuration tab, use the Quick Set control to select the Tiva C Series LaunchPad evaluation board. 7. Move to the Program tab and click the Browse button.
PAGE 7
References, PCB Layout, and Bill of Materials www.ti.com 4.2 Bill of Materials (BOM) Table 3 shows the bill of materials for the BOOSTXL-SENSHUB BoosterPack board. Table 3.
PAGE 8
A B C D Temperature Sensor U1 TMP006 B1 3.3V C1 ANALOG_GND A2 Pressure Sensor DGND SDA ADR1 SCL ADR0 V+ AGND DRDY C3 3.3V B3 I2C_SCL A3 9-Axis Motion Sensor ANALOG_PWR 1 C1 U3 MPU-9150 C2 I2C_SDA R1 10k INT_TEMP 1 U2 BMP180 I2C_SDA 100nF 2 3 CSB SDA VDD 6 I2C_SDA 5 I2C_SCL SCK VDDIO GND A1 I2C_SCL 1 SDO 4 7 3.
PAGE 9
A B C D RF Headers LaunchPad Headers RF_PART1 1 U1RTS RF_PART2 1 2 3 4 1.8V 1 2 3 4 32.768_CLK 5 6 5 6 U1TX 7 8 7 8 U1RX 9 10 9 10 3.3V RF_GPIO0 RF_I2C_SDA 11 12 RF_GPIO1 RF_I2C_SCL 13 14 SSI0FSS 15 16 SSI0CLK 17 18 SSI0TX 19 20 SSI0RX RF_GPIO2 RF_RST RF_SHUTDN 11 12 13 14 J1 3.
PAGE 10
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
PAGE 11
FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
PAGE 12
【Important Notice for Users of this Product in Japan】】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.
PAGE 13
EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use.
PAGE 14
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.