Datasheet
AMC7812
SBAS513E –JANUARY 2011–REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM
RELATIVE DIFFERENTIAL SPECIFIED
ACCURACY NONLINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE
PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING
QFN-64 RGC –40°C to +105°C AMC7812
AMC7812 ±1 ±1
HTQFP-64 PAP –40°C to +105°C AMC7812
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
AMC7812 UNIT
AV
DD
to GND –0.3 to +6 V
DV
DD
to GND –0.3 to +6 V
IOV
DD
to GND –0.3 to +6 V
AV
CC
to GND –0.3 to +18 V
DV
DD
to DGND –0.3 to +6 V
Analog input voltage to GND –0.3 to AV
DD
+ 0.3 V
ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND –0.3 to +6 V
D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND –0.3 to AV
DD
+ 0.3 V
Digital input voltage to DGND –0.3 to IOV
DD
+ 0.3 V
SDO and DAV to GND –0.3 to IOV
DD
+ 0.3 V
Operating temperature range –40 to +105 °C
Storage temperature range –40 to +150 °C
Junction temperature range (T
J
max) +150 °C
Human body model (HBM) 2.5 kV
ESD ratings
Charged device model (CDM) 1.0 kV
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC7812
THERMAL METRIC
(1)
RGC (QFN) PAP (HTQFP) UNITS
64 PINS 64 PINS
θ
JA
Junction-to-ambient thermal resistance 24.1 33.7
θ
JCtop
Junction-to-case (top) thermal resistance 8.1 9.5
θ
JB
Junction-to-board thermal resistance 3.2 9.0
°C/W
ψ
JT
Junction-to-top characterization parameter 0.1 0.3
ψ
JB
Junction-to-board characterization parameter 3.3 8.9
θ
JCbot
Junction-to-case (bottom) thermal resistance 0.6 0.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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