Datasheet

AMC1204
AMC1204B
SBAS512D –APRIL 2011–REVISED DECEMBER 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
FAMILY OVERVIEW
MODULATOR DIGITAL GAIN ERROR
PART NUMBER CLOCK (MHz) SUPPLY CLOCK SOURCE INL (LSB) (%) THD (dB)
AMC1203 10 5V Internal ±9 ±2 –84.5
AMC1203B 10 5V Internal ±6 ±1 –88
AMC1204 20 3V, 3.3V, or 5V External ±8 ±2 –80
AMC1204B 20 3V, 3.3V, or 5V External ±8 ±2 –80
ABSOLUTE MAXIMUM RATINGS
(1)
Over the operating ambient temperature range, unless otherwise noted.
AMC1204, AMC1204B
PARAMETER MIN MAX UNIT
Supply voltage, AVDD to AGND or DVDD to DGND –0.3 +6 V
Analog input voltage at VINP, VINN AGND – 0.5 AVDD + 0.5 V
Digital input voltage at CLKIN DGND – 0.3 DVDD + 0.3 V
Input current to any pin except supply pins –10 +10 mA
Maximum virtual junction temperature, T
J
+150 °C
Operating ambient temperature range, T
OA
–40 +125 °C
Human body model (HBM)
–3000 +3000 V
JEDEC standard 22, test method A114-C.01
Electrostatic discharge (ESD), Charged device model (CDM)
–1500 +1500 V
all pins JEDEC standard 22, test method C101
Machine model (MM)
–200 +200 V
JEDEC standard 22, test method A115A
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC1204, AMC1204B
THERMAL METRIC
(1)
DW DWV UNITS
16 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 78.5 106.5
θ
JCtop
Junction-to-case (top) thermal resistance 41.3 53.6
θ
JB
Junction-to-board thermal resistance 50.2 60.3
°C/W
ψ
JT
Junction-to-top characterization parameter 11.5 18.5
ψ
JB
Junction-to-board characterization parameter 41.2 58.9
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: AMC1204 AMC1204B