Datasheet

AMC1203
SBAS427C –FEBRUARY 2008– REVISED JUNE 2011 www.ti.com
PACKAGE CHARACTERISTICS
(1)
Over recommended operating conditions, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DUB 7 mm
Shortest terminal to terminal distance
L(I01) Minimum air gap (clearance) DW 8 mm
through air
PSA 6.3 mm
DUB 7 mm
Minimum external tracking Shortest terminal to terminal distance
L(I02) DW 8 mm
(creepage) across the package surface
PSA 6.3 mm
Tracking resistance (comparative
CTI DIN IEC 60112 / VDE 0303 Part 1 ≥ 175 V
tracking index)
Minimum internal gap (internal
Distance through the insulation 0.008 mm
clearance)
Input to output, V
IO
= 500V, all pins on each side
of the barrier tied together creating a two-terminal > 10
12
Ω
device, T
A
< +85°C
R
IO
Isolation resistance
Input to output, V
IO
= 500V,
> 10
11
Ω
+100°C ≤ T
A
< T
A
max
C
IO
Barrier capacitance input to output V
I
= 0.8V
PP
at 1MHz 1.2 pF
C
I
Input capacitance to ground V
I
= 0.8V
PP
at 1MHz 3 pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the isolator
on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to
the measurement techniques shown in the Isolation Glossary . Techniques such as inserting grooves and/or ribs on a printed
circuit board are used to help increase these specifications.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A
failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient
power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings
table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware
determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is
that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction
temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
S
Safety input, output, or supply current θ
JA
= 246°C/W, V
I
= 5.5V, T
J
= +150°C, T
A
= +25°C 90 mA
T
C
Maximum case temperature +150 °C
IEC 61000-4-5 RATINGS
PARAMETER TEST CONDITIONS VALUE UNIT
V
IOSM
Surge immunity 1.2/50μs voltage surge and 8/20μs current surge ±6000 V
IEC 60664-1 RATINGS
PARAMETER TEST CONDITIONS SPECIFICATION
Basic isolation group Material group IIIa
Rated mains voltage ≤ 150 V
RMS
I-IV
Installation classification
Rated mains voltage < 300 V
RMS
I-III
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