Datasheet

AM3517, AM3505
SPRS550E –OCTOBER 2009–REVISED MARCH 2013 www.ti.com
1 Device Summary ........................................ 1 4.3 Output Clock Specifications ........................ 95
1.1 Features ............................................. 1 4.4 DPLL Specifications ................................ 97
1.2 Applications .......................................... 2 5 Video DAC Specifications .......................... 100
1.3 Description ........................................... 3 5.1 Interface Description .............................. 101
5.2 Electrical Specifications Over Recommended
1.4 Functional Block Diagram ........................... 4
Operating Conditions .............................. 102
1.5 ZCN and ZER Package Differences ................. 5
5.3 Analog Supply (vdda_dac) Noise Requirements . 104
Revision History .............................................. 7
5.4 External Component Value Choice ............... 105
2 Terminal Description ................................... 8
6 Timing Requirements and Switching
2.1 Pin Assignments ..................................... 8
Characteristics ....................................... 106
2.2 Ball Characteristics ................................. 17
6.1 Timing Test Conditions ........................... 106
2.3 Multiplexing Characteristics ........................ 51
6.2 Interface Clock Specifications ..................... 106
2.4 Signal Description .................................. 57
6.3 Timing Parameters ................................ 107
3 Electrical Characteristics ............................ 80
6.4 External Memory Interfaces ....................... 108
3.1 Absolute Maximum Ratings ........................ 80
6.5 Video Interfaces ................................... 150
3.2 Recommended Operating Conditions .............. 82
6.6 Serial Communications Interfaces ................ 155
3.3 DC Electrical Characteristics ....................... 84
6.7 Removable Media Interfaces ...................... 197
3.4 Core Voltage Decoupling ........................... 86
6.8 Test Interfaces .................................... 211
3.5 Power-up and Power-down ......................... 88
7 Package Characteristics ............................ 215
4 Clock Specifications .................................. 91
7.1 Package Thermal Resistance ..................... 215
4.1 Oscillator ........................................... 92
7.2 Device Support .................................... 215
4.2 Input Clock Specifications .......................... 93
7.3 Mechanical Data .................................. 217
6 Contents Copyright © 2009–2013, Texas Instruments Incorporated
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