Datasheet

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AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
SPRS717E –OCTOBER 2011–REVISED JANUARY 2013 www.ti.com
Complete stackup specifications are provided in Table 5-44.
Table 5-44. PCB Stackup Specifications
(1)
NO. PARAMETER MIN TYP MAX UNIT
1 PCB routing and plane layers 4
2 Signal routing layers 2
3 Full ground layers under DDR2 routing region 1
4 Number of ground plane cuts allowed within DDR2 routing region 0
5 Full VDDS_DDR power reference layers under DDR2 routing region 1
6 Number of layers between DDR2 routing layer and reference ground plane 0
7 PCB routing feature size 4 mils
8 PCB trace width, w 4 mils
9 PCB BGA escape via pad size
(2)
18 20 mils
10 PCB BGA escape via hole size
(2)
10 mils
ZCZ package 0.5
11 AM335x BGA pad size mm
ZCE package 0.4
13 Single-ended impedance, Zo
(3)
50 75 ohms
14 Impedance control
(4)(5)
Zo-5 Zo Zo+5 ohms
(1) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.
(2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the
AM335x device.
(3) Zo is the nominal singled-ended impedance selected for the PCB.
(4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo
defined by the single-ended impedance parameter.
(5) Tighter impedance control is required to ensure flight time skew is minimal.
158 Peripheral Information and Timings Copyright © 2011–2013, Texas Instruments Incorporated
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