Datasheet

AFE5808A
www.ti.com SLOS729B –OCTOBER 2011–REVISED APRIL 2012
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
AVDD –0.3 to 3.9 V
AVDD_ADC –0.3 to 2.2 V
Supply voltage
range
AVDD_5V –0.3 to 6 V
DVDD –0.3 to 2.2 V
Voltage between AVSS and LVSS –0.3 to 0.3 V
Voltage at analog inputs and digital inputs –0.3 to min [3.6,AVDD+0.3] V
Peak solder temperature
(2)
260 °C
Maximum junction temperature (T
J
), any condition 105 °C
Storage temperature range –55 to 150 °C
Operating temperature range 0 to 85 °C
HBM 2000 V
ESD Ratings
CDM 500 V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) Device complies with JSTD-020D.
THERMAL INFORMATION
AFE5808A
THERMAL METRIC
(1)
BGA UNITS
135 PINS
θ
JA
Junction-to-ambient thermal resistance 34.1
θ
JCtop
Junction-to-case (top) thermal resistance 5
θ
JB
Junction-to-board thermal resistance 11.5
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2
ψ
JB
Junction-to-board characterization parameter 10.8
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
PARAMETER MIN MAX UNIT
AVDD 3.15 3.6 V
AVDD_ADC 1.7 1.9 V
DVDD 1.7 1.9 V
AVDD_5V 4.75 5.5 V
Ambient Temperature, T
A
0 85 °C
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