Datasheet

35
33
31
29
27
25
23
21
19
17
15
Thermal Resistance (°C/W)
0.5 1 1.5 2 2.5
Cu Thickness (oz)
Four-Layer PCB, PCB
Area = 4.32 in , 2 oz Cu
(Results are from thermal
simulations)
2
28
26
24
22
20
18
16
14
12
10
Thermal Resistance (°C/W)
2
4
6 8 10 12 14
PCB Area (in )
2
THERMAL RESISTANCE vs BOARD AREA
Four-Layer PCB, 2 oz Cu
(Results are from thermal
simulations)
1 2 3
4 5
6
7
8
Number of Layers
36
34
32
30
28
26
24
22
20
Thermal Resistance ( C/W)°
THERMAL RESISTANCE vs NUMBER OF PCB LAYERS
PCB Area = 3 in , 2 oz Cu
(Results are from thermal
simulations)
2
AFE031
SBOS531D –AUGUST 2010–REVISED MAY 2012 www.ti.com
Increasing the number of layers in the PCB, using thicker copper, and increasing the PCB area are all factors
that improve the spread of heat. Figure 55 through Figure 57, respectively, show thermal resistance performance
as a function of each of these factors.
Figure 55. Thermal Resistance as a Function of the Number of Layers in the PCB
Figure 56. Thermal Resistance as a Function of PCB Area
Figure 57. Thermal Resistance as a Function of Copper Thickness
48 Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): AFE031