Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- ELECTRICAL CHARACTERISTICS: Transmitter (Tx)
- ELECTRICAL CHARACTERISTICS: Power Amplifier (PA)
- ELECTRICAL CHARACTERISTICS: Receiver (Rx)
- ELECTRICAL CHARACTERISTICS: Digital
- ELECTRICAL CHARACTERISTICS: Two-Wire Interface
- ELECTRICAL CHARACTERISTICS: Internal Bias Generator
- ELECTRICAL CHARACTERISTICS: Power Supply
- THERMAL INFORMATION
- SPI TIMING REQUIREMENTS
- DEVICE INFORMATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- Revision History
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SBOS531D –AUGUST 2010–REVISED MAY 2012
Figure 53. Heat Flow in the QFN Package
The exposed thermal pad must be soldered to the PCB thermal pad. The thermal pad on the PCB should be the
same size as the exposed thermal pad on the underside of the QFN package. Refer to Application Report,
QFN/SON PCB Attachment, literature number SLUA271A, for recommendations on attaching the thermal pad to
the PCB. Figure 54 illustrates the direction of heat spreading into the PCB from the device.
Figure 54. Heat Spreading into PCB
The heat spreading into the PCB is maximized if the thermal path is uninterrupted. Best results are achieved if
the heat-spreading surfaces are filled with copper to the greatest extent possible, maximizing the percent area
covered on each layer. As an example, a thermally robust, multilayer PCB design may consist of four layers with
copper (Cu) coverage of 60% in the top layer, 85% and 90% in the inner layers, respectively, and 95% on the
bottom layer.
Copyright © 2010–2012, Texas Instruments Incorporated 47
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