Datasheet

DGND
Tx_PGA_IN
DVDD
Tx_PGA_OUT
SCLK
Tx_F_IN1
DIN
Tx_F_IN2
DOUT
Tx_F_OUT
CS
PA_IN
DAC
REF1
SD
Rx_PGA2_OUT
INT
Rx_PGA2_IN
TSENSE
Rx_F_OUT
AVDD1
Rx_C2
AGND1
ZC_OUT2
E_Tx_CLK
E_Tx_IN
E_Tx_OUT
E_Rx_IN
E_Rx_OUT
AVDD2
AGND2
REF2
Rx_PGA1_IN
Rx_PGA1_OUT
Rx_F_IN
Rx_C1
Rx_FLAG Tx_FLAG
PA_ISET PA_VS1 PA_VS2 PA_OUT1 PA_OUT2 PA_GND1 PA_GND2 ZC_IN1 ZC_IN2 ZC_OUT1
1
2
3
4
5
6
7
8
9
10
11
12
13
48
14
47
15
46
16
45
17
44
18
43
19
42
20
41
21
40
22
39
23
38
24
37
25
26
27
28
29
30
31
32
33
34
35
36
Thermal Pad
AFE031
www.ti.com SBOS531D –AUGUST 2010–REVISED MAY 2012
DEVICE INFORMATION
PIN ASSIGNMENTS
RGZ PACKAGE
QFN-48
(TOP VIEW)
NOTE: Exposed thermal pad is connected to ground.
Copyright © 2010–2012, Texas Instruments Incorporated 13
Product Folder Link(s): AFE031