Datasheet

AFE030
SBOS588A –DECEMBER 2011– REVISED DECEMBER 2011 www.ti.com
THERMAL INFORMATION
AFE030
THERMAL METRIC
(1)
RGZ (QFN) UNITS
48 PINS
θ
JA
Junction-to-ambient thermal resistance 27.8
θ
JCtop
Junction-to-case (top) thermal resistance 12.1
θ
JB
Junction-to-board thermal resistance 7.5
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 7.4
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
PARAMETER MEASUREMENT INFORMATION
TIMING REQUIREMENTS
SPI TIMING REQUIREMENTS
PARAMETER CONDITION MIN TYP MAX UNIT
Input capacitance 1 pF
Input rise/fall time t
RFI
CS, DIN, SCLK 2 ns
Output rise/fall time t
RFO
DOUT 10 ns
CS high time t
CSH
CS 20 ns
SCLK edge to CS fall setup time t
CS0
10 ns
CS fall to first SCLK edge setup time t
CSSC
10 ns
SCLK frequency f
SCLK
20 MHz
SCLK high time t
HI
20 ns
SCLK low time t
LO
20 ns
SCLK last edge to CS rise setup time t
SCCS
10 ns
CS rise to SCLK edge setup time t
CS1
10 ns
DIN setup time t
SU
10 ns
DIN hold time t
HD
5 ns
SCLK to DOUT valid propagation delay t
DO
20 ns
CS rise to DOUT forced to Hi-Z t
soz
20 ns
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Product Folder Link(s): AFE030