Datasheet

www.ti.com
ABSOLUTE MAXIMUM RATINGS
ADS8411
SLAS369B – APRIL 2002 – REVISED DECEMBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM NO MISSING
PACKAGE TEMPERA- TRANSPORT
INTEGRAL DIFFERENTIAL CODES PACKAGE ORDERING
MODEL DESIG- TURE MEDIA
LINEARITY LINEARITY RESOLUTION TYPE INFORMATION
NATOR RANGE QUANTITY
(LSB) (LSB) (BIT)
Tape and reel
ADS8411IPFBT
250
48 Pin
ADS8411I –6 ~ 6 –2~3 15 PFB –40 ° C to 85 ° C
TQFP
Tape and reel
ADS8411IPFBR
1000
Tape and reel
ADS8411IBPFBT
250
48 Pin
ADS8411IB –2.5 ~ 2.5 –1~2 16 PFB –40 ° C to 85 ° C
TQFP
Tape and reel
ADS8411IBPFBR
1000
(1) For the most current specifications and package information, refer to our website at www.ti.com.
over operating free-air temperature range unless otherwise noted
(1)
UNIT
+IN to AGND –0.4 V to +VA + 0.1 V
Voltage
–IN to AGND –0.4 V to 0.5 V
+VA to AGND –0.3 V to 7 V
Voltage range +VBD to BDGND –0.3 V to 7 V
+VA to +VBD –0.3 V to 2.55 V
Digital input voltage to BDGND –0.3 V to +VBD + 0.3 V
Digital output voltage to BDGND –0.3 V to +VBD + 0.3 V
T
A
Operating free-air temperature range –40 ° C to 85 ° C
T
stg
Storage temperature range –65 ° C to 150 ° C
Junction temperature (T
J
max) 150 ° C
Power dissipation (T
J
Max - T
A
)/ θ
JA
TQFP package
θ
JA
thermal impedance 86 ° C/W
Vapor phase (60 sec) 215 ° C
Lead temperature, soldering
Infrared (15 sec) 220 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2