Datasheet


SLAS390B − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
2
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
MODEL
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
MAXIMUM
DIFFERENTIAL
LINEARITY
(LSB)
NO
MISSING
CODES
RESOLU-
TION (BIT)
PACKAGE
TYPE
PACKAGE
DESIGNATOR
TEMPER-
ATURE
RANGE
ORDERING
INFORMATION
TRANS-
PORT
MEDIA
QUANTITY
ADS8371I
±2.5
−1/1.5
16
48 Pin
PFB
−40
°
C to
ADS8371IPFBT
Tape and
reel 250
ADS8371I
±
2.5
−1/1.5
16
48 Pin
TQFP
PFB
−40 C to
85°C
ADS8371IPFBR
Tape and
reel 1000
ADS8371IB
±1.5
±1
16
48 Pin
PFB
−40
°
C to
ADS8371IBPFBT
Tape and
reel 250
ADS8371IB
±
1.5
±
1
16
48 Pin
TQFP
PFB
−40 C to
85°C
ADS8371IBPFBR
Tape and
reel 1000
NOTE:
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
UNIT
+IN to AGND −0.4 V to +VA + 0.1 V
−IN to AGND −0.4 V to 0.5 V
+VA to AGND −0.3 V to 7 V
Voltage range
+VBD to BDGND −0.3 V to 7 V
+VA to +VBD −0.3 V to 2.55 V
Digital input voltage to BDGND −0.3 V to +VBD + 0.3 V
Digital output voltage to BDGND −0.3 V to +VBD + 0.3 V
Operating free-air temperature range, T
A
−40°C to 85°C
Storage temperature range, T
stg
−65°C to 150°C
Junction temperature (T
J
max) 150°C
Power dissipation (T
J
Max − T
A
)/θ
JA
θ
JA
thermal impedance 86°C/W
Lead temperature, soldering
Vapor phase (60 sec) 215°C
Lead temperature, soldering
Infrared (15 sec) 220°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.