Datasheet
ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
ADS8365
SBAS362C – AUGUST 2006 – REVISED MARCH 2008 ....................................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
MAXIMUM NO
INTEGRAL MISSING
LINEARITY CODES SPECIFIED TRANSPORT
ERROR ERROR PACKAGE- PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY
ADS8365IPAG Tray, 160
ADS8365 ± 4 14 TQFP-64 PAG – 40 ° C to +85 ° C ADS8365AI
Tape and
ADS8365IPAGR
Reel, 1500
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
over operating free-air temperature range (unless otherwise noted)
ADS8365 UNIT
Supply voltage, AGND to AV
DD
– 0.3 to 6 V
Supply voltage, BGND to BV
DD
– 0.3 to 6 V
Analog input voltage range AGND – 0.3 to AV
DD
+ 0.3 V
Reference input voltage range AGND – 0.3 to AV
DD
+ 0.3 V
Digital input voltage range BGND – 0.3 to BV
DD
+ 0.3 V
Ground voltage differences, AGND to BGND ± 0.3 V
Voltage differences, BV
DD
to AGND – 0.3 to 6 V
Input current to any pin except supply – 20 to 20 mA
Power dissipation See Dissipation Ratings Table
Operating virtual junction temperature range, T
J
– 40 to +150 ° C
Operating free-air temperature range, T
A
– 40 to +85 ° C
Storage temperature range, T
STG
– 65 to +150 ° C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
DERATING
FACTOR ABOVE T
A
≤ +25 ° C T
A
= +70 ° C T
A
= +85 ° C
BOARD PACKAGE R
θ JC
R
θ JA
T
A
= +25 ° C POWER RATING POWER RATING POWER RATING
Low-K
(1)
PAG 8.6 ° C/W 68.5 ° C/W 14.598mW/ ° C 1824mW 1168mW 949mW
High-K
(2)
PAG 8.6 ° C/W 42.8 ° C/W 23.364mW/ ° C 2920mW 1869mW 1519mW
(1) The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top
of the board.
(2) The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and
ground planes, and 2-ounce copper traces on the top and bottom of the board.
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