Datasheet
ADS8361
6
SBAS230E
www.ti.com
PIN CONFIGURATION
Top View SSOP
BGND
CH B1+
CH B1–
CH B0+
CH B0–
CH A1+
CH A1–
CH A0+
CH A0–
REF
IN
REF
OUT
AGND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
BV
DD
SERIAL DATA A
SERIAL DATA B
BUSY
CLOCK
CS
RD
CONVST
A0
M0
M1
AV
DD
ADS8361
Top View QFN
SSOP QFN
PIN PIN NAME DESCRIPTION
128BGND
Digital I/O Ground. Connect directly to analog ground (pin 12).
2 1 CH B1+ Noninverting Input Channel B1
3 2 CH B1– Inverting Input Channel B1
4 3 CH B0+ Noninverting Input Channel B0
5 4 CH B0– Inverting Input Channel B0
6 5 CH A1+ Noninverting Input Channel A1
7 6 CH A1– Inverting Input Channel A1
8 7 CH A0+ Noninverting Input Channel A0
9 8 CH A0– Inverting Input Channel A0
10 9 REF
IN
Reference Input
11 10 REF
OUT
2.5V Reference Output
12 12 AGND
Analog Ground. Connect directly to digital ground (pin 1).
13 13 AV
DD
Analog Power Supply, +5V
DC
. Decouple to analog ground with a 0.1μF ceramic capacitor and a 10μF tantalum capacitor.
14 16 M1 Selects between the Serial Outputs. When M1 is LOW, both Serial Output A and Serial Output B are selected for data transfer. When M1
is HIGH, Serial output A is configured for both Channel A data and Channel B data; Serial Output B goes into tri-state (i.e., high impedance).
15 17 M0 Selects between two-channel and four-channel operation. When M0 is LOW, two-channel operation is selected and operates in
conjunction with A0. When A0 is HIGH, Channel A1 and Channel B1 are being converted. When A0 is LOW, Channel A0 and Channel
B0 are being converted. When M0 is HIGH, four-channel operation is selected. In this mode, all four channels are converted in sequence
starting with Channels A0 and B0, followed by Channels A1 and B1.
16 18 A0 A0 operates in conjunction with M0. With M0 LOW and A0 HIGH, Channel A1 and Channel B1 are converted. With M0 LOW and A0 LOW,
Channel A0 and Channel B0 are converted.
17 19 CONVST Convert Start. When CONVST switches from LOW to HIGH, the device switches from the sample to hold mode, independent of the status
of the external clock.
18 20 RD Synchronization Pulse for the Serial Output.
19 21 CS Chip Select. When LOW, the Serial Output A and Serial Output B outputs are active; when HIGH, the serial outputs are tri-stated.
20 22 CLOCK An external CMOS-compatible clock can be applied to the CLOCK input to synchronize the conversion process to an external source.
The CLOCK pin controls the sampling rate by the equation: f
SAMPLE
(max) = CLOCK/20.
21 23 BUSY BUSY goes HIGH during a conversion and returns LOW after the third LSB has been transmitted on either the Serial A or Serial B output
pin.
22 24 SERIAL The Serial Output data word is comprised of channel information and 16 bits of data. In operation, data is valid on the falling edge of
DCLOCK for 20 edges after the rising edge of RD.
23 25 SERIAL The Serial Output data word is comprised of channel information and 16 bits of data. In operation, data is valid on the falling edge of
DCLOCK for 20 edges after the rising edge of RD. When M1 is HIGH, both Channel A data and Channel B data are available.
24 27 BV
DD
Digital I/O Power Supply, 2.7V to 5.5V
PIN DESCRIPTIONS
DATA B
DATA A
CH B1+
CH B1−
CH B0+
CH B0−
CH A1+
CH A1−
CH A0+
CH A0−
SERIAL DATA B
BUSY
CLOCK
CS
RD
CONVST
A0
M0
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
ADS8361
(1)
NC
(2)
NC
(2)
NC
(2)
NC
(2)
BGND
BVDD
NC
(2)
SERIAL DATA A
32
31
30
29
28
27
26
25
REF
IN
REF
OUT
NC
(2)
AGND
AV
DD
NC
(2)
NC
(2)
M1
9
10
11
12
13
14
15
16
NOTE: (1) The thermal pad is internally connected to the substrate.
This pad can be connected to the analog ground or left floating.
Keep the thermal pad separate from the digital ground, if possible.
(2) NC = Not Connected.