Datasheet

ADS8344
2
SBAS139E
MINIMUM
RELATIVE MAXIMUM SPECIFIED PACKAGE
ACCURACY GAIN ERROR TEMPERATURE PACKAGE DRAWING ORDERING TRANSPORT
PRODUCT (LSB) (%) RANGE DESIGNATOR PACKAGE-LEAD NUMBER NUMBER MEDIA, QUANTITY
ADS8344E 8 ±0.05 –40°C to +85°C DBQ QSOP-20 DBQ ADS8344E Rails, 56
" " " " " " " ADS8344E/2K5 Tape and Reel, 2500
ADS8344N " " " DB SSOP-20 DB ADS8344N Rails, 68
" " " " " " " ADS8344N/1K Tape and Reel, 1000
ADS8344EB 6 ±0.024 –40°C to +85°C DBQ QSOP-20 DBQ ADS8344EB Rails, 56
" " " " " " " ADS8344EB/2K5 Tape and Reel, 2500
ADS8344NB " " " DB SSOP-20 DB ADS8344NB Rails, 68
" " " " " " " ADS8344NB/1K Tape and Reel, 1000
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at
www.ti.com.
PACKAGE/ORDERING INFORMATION
(1)
ABSOLUTE MAXIMUM RATINGS
(1)
+V
CC
to GND ........................................................................ –0.3V to +6V
Analog Inputs to GND ............................................ –0.3V to +V
CC
+ 0.3V
Digital Inputs to GND ........................................................... –0.3V to +6V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ........................................–40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PIN CONFIGURATION
Top View SSOP
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
1 CH0 Analog Input Channel 0
2 CH1 Analog Input Channel 1
3 CH2 Analog Input Channel 2
4 CH3 Analog Input Channel 3
5 CH4 Analog Input Channel 4
6 CH5 Analog Input Channel 5
7 CH6 Analog Input Channel 6
8 CH7 Analog Input Channel 7
9 COM
Ground reference for analog inputs. Sets zero code
voltage in single–ended mode. Connect this pin to ground
or ground reference point.
10 SHDN Shutdown. When LOW, the device enters a very
low-power shutdown mode.
11 V
REF
Voltage Reference Input. See Electrical Characteristics
Table for ranges.
12 +V
CC
Power Supply, 2.7V to 5V
13 GND Ground
14 GND Ground
15 D
OUT
Serial Data Output. Data is shifted on the falling edge of
DCLK. This output is high impedance when CS is HIGH.
16 BUSY Busy Output. Busy goes LOW when the D
IN
control bits
are being read and also when the device is converting.
The Output is high impedance when CS is HIGH.
17 D
IN
Serial Data Input. If CS is LOW, data is latched on rising
edge of D
CLK
.
18 CS Chip Select Input. Active LOW. Data will not be clocked
into D
IN
unless CS is LOW. When CS is HIGH, D
OUT
is
high impedance.
19 DCLK External Clock Input. The clock speed determines the
conversion rate by the equation f
DCLK
= 24 • f
SAMPLE
.
20 +V
CC
Power Supply
1
2
3
4
5
6
7
8
9
10
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
SHDN
+V
CC
DCLK
CS
D
IN
BUSY
D
OUT
GND
GND
+V
CC
V
REF
20
19
18
17
16
15
14
13
12
11
ADS8344
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments
recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation proce-
dures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.