Datasheet

PIN ASSIGNMENTS
REF+(REFIN)
NC
CONVST
EOC/ /CDIINT
RESERVED
+VA
+VBD
SCLK
1
2
3
4
12
11
10
9
REF-
16
FS/
CS
5
AGND
15
SDI
6
-IN
14
SDO
7
+IN
13
BDGND
8
REF+(REFIN)
NC
CONVST
EOC/ /CDIINT
+IN1
+VA
+VBD
SCLK
1
2
3
4
12
11
10
9
REF-
16
FS/CS
5
AGND
15
SDI
6
COM
14
SDO
7
+IN0
13
BDGND
8
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT/CDI
CONVST
+VA
RESERVED
+IN
-IN
AGND
REF-
REF+(REFIN)
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT/CDI
CONVST
+VA
+IN1
+IN0
COM
AGND
REF-
REF+(REFIN)
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ADS8329
ADS8330
SLAS516C – DECEMBER 2006 – REVISED JULY 2009 ................................................................................................................................................... www.ti.com
ADS8329
ADS8330
RSA PACKAGE
RSA PACKAGE
(TOP VIEW)
(TOP VIEW)
CAUTION: The thermal pad is internally connected to the substrate. This pad can be connected to the analog
ground or left floating. Keep the thermal pad separate from the digital ground, if possible.
ADS8329
ADS8330
PW PACKAGE
PW PACKAGE
(TOP VIEW)
(TOP VIEW)
NC = No internal connection
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