Datasheet

1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
+VA
RESERVED
+IN
−IN
AGND
REF−
REF+ (REFIN)
NC
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT
CONVST
ADS8327
PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
+VA
+IN1
+IN0
COM
AGND
REF−
REF+ (REFIN)
NC
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT
CONVST
ADS8328
PW PACKAGE
(TOP VIEW)
NC − No internal connection
1
2
3
4
9
10
11
12
5
6 7 8
13141516
REF+(REFIN)
NC
CONVST
EOC/INT/CDI
RESERVED
+VA
+VBD
SCLK
FS/CS
SDI
SDO
BDGND
+IN
−IN
AGND
REF−
ADS8327
RSA PACKAGE
(TOP VIEW)
1
2
3
4
9
10
11
12
5
6 7 8
13141516
REF+(REFIN)
NC
CONVST
EOC/INT/CDI
+IN1
+VA
+VBD
SCLK
FS/CS
SDI
SDO
BDGND
+IN0
COM AGND
REF−
ADS8328
RSA PACKAGE
(TOP VIEW)
NC − No internal connection
CAUTION: The thermal pad is internally connected to the substrate. This pad can be connected to the analog ground or left
floating. Keep the thermal pad separate from the digital ground, if possible.
ADS8327
ADS8328
SLAS415E – APRIL 2006– REVISED JANUARY 2011 www.ti.com
PIN ASSIGNMENTS
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Product Folder Link(s): ADS8327 ADS8328