Datasheet
1
2
3
4
8
7
6
5
V
DD
DCLOCK
D
OUT
CS/SHDN
REF
+IN
-IN
GND
ADS8326
REF
+IN
-IN
GND
V
DD
DCLOCK
D
OUT
CS/SHDN
1
2
3
4
8
7
6
5
ADS8326
(ThermalPad)
R
50W
ON
C
(SAMPLE)
48pF
V
DD
I/O
GND
V
DD
ANALOGIN
GND
DiodeTurn-OnVoltage:0.35V
EquivalentAnalogInputCircuit
V
DD
REF
GND
EquivalentReferenceInputCircuit
EquivalentDigitalInput/OutputCircuit
24pF
R
50W
ON
ADS8326
www.ti.com
.................................................................................................................................................. SBAS343C –MAY 2007–REVISED SEPTEMBER 2009
PIN CONFIGURATION
DGK PACKAGE
MSOP-8
(TOP VIEW)
DRB PACKAGE
SON-8
(TOP VIEW)
(1) The thermal pad is internally connected to the substrate. This pad can be connected to the analog ground or left
floating. Keep the thermal pad separate from the digital ground, if possible.
PIN ASSIGNMENTS
PIN
I/O DESCRIPTION
NAME NO.
REF 1 Analog input Reference input
+IN 2 Analog input Noninverting input
–IN 3 Analog input Inverting analog input
GND 4 Power-supply connection Ground
CS/SHDN 5 Digital input Chip select when low; Shutdown mode when high.
D
OUT
6 Digital output Serial output data word
DCLOCK 7 Digital input Data clock synchronizes the serial data transfer and determines conversion speed.
V
DD
8 Power-supply connection Power supply
Equivalent Input Circuit (V
DD
= 5.0V)
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