Datasheet
www.ti.com
PIN CONFIGURATIONS
1
2
3
4
8
7
6
5
+V
DD
DCLOCK
D
OUT
CS/SHDN
REF
+IN
-IN
GND
ADS8325
REF
+IN
-IN
GND
+V
DD
DCLOCK
D
OUT
CS/SHDN
1
2
3
4
8
7
6
5
ADS8325
(ThermalPad)
ADS8325
SBAS226C – MARCH 2002 – REVISED AUGUST 2007
DGK PACKAGE
MSOP
(TOP VIEW)
DRB PACKAGE
(1)
SON
(TOP VIEW)
(1) The thermal pad is internally connected to the substrate. This pad can be connected to the analog ground or left
floating. Keep the thermal pad separate from the digital ground, if possible.
PIN ASSIGNMENTS
PIN
NAME NO. I/O
(1)
DESCRIPTION
REF 1 AI Reference Input
+IN 2 AI Noninverting Input
– IN 3 AI Inverting Analog Input
GND 4 P Ground
CS/SHDN 5 DI Chip select when low; Shutdown mode when high.
D
OUT
6 DO The serial output data word.
DCLOCK 7 DI Data clock synchronizes the serial data transfer and determines conversion speed.
+V
DD
8 P Power supply
(1) AI is Analog Input, DI is Digital Input, DO is Digital Output, and P is Power-Supply Connection.
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