Datasheet

Appendix A Bill of Materials (BOM) and Schematic
www.ti.com Appendix A
Table A-1 contains a complete bill of materials for the modular MSOP-8EVM. The schematic diagram is
also provided.
Table A-1. Bill of Materials
Designators Description Manufacturer Mfg. Part Number
C2, C3, C4, C13 Not Installed
R11 Not Installed
C1 0.47 µ F, 0805, Ceramic, X7R, 10% Panasonic ECJ-2YB1C474K
C11, C12, C14 0.1 µ F, 0805, Ceramic, X7R, 50V, 10% Panasonic ECJ-2YB1H104K
C6, C8, C10 10 µ F, 1206, Ceramic, Y5V, 10V, 10% Panasonic ECJ-3YF1A106Z
C5, C14, C15 10 µ F, A Case, Tantalum, 10V Panasonic ECS-T1AY106R
L1, L2, L3 15 µ H Inductor, SMT, 1608 Series Inductors, Inc. CTDS1608C-153
J1, J2 (top side) 10 Pin, Dual Row, SMT Header (20 Pos.) Samtec TSM-110-01-T-DV-P
J1B, J2B (bottom side) 10 Pin, Dual Row, SMT Socket (20 Pos.) Samtec SSW-110-22-F-D-VS-K
J3 (bottom side) 5 Pin, Dual Row, SMT Socket (10 Pos.) Samtec SSW-105-22-F-D-VS-K
R9, R10 33 Ω , 0805, 5%, 0.1W Resistor Yageo America 9C08052A33R0JLHFT
R1, R2, R3, R4, R6 0 Ω , 0805, 0.1W Resistor Yageo America 9C08052A0R00JLHFT
TP1, TP2, TP3, TP5, TP7 Red Test Point Loop Keystone 5001
TP4, TP6 Black Test Point Loop Keystone 5000
U1 Varies
(1)
U2 REF3025 TI REF3025AIDBZT
U3, U5, U6 SN74LVC1G125 TI SN74LVC1G125DBVT
U4 OPA353N TI OPA353NA/250
JMP1, JMP2, JMP5, JMP6 3 Pin , 2mm Header Samtec TMMH-103-C-S-T
JMP3 4 Pin, Dual Row, TH Header (8 Pos.) Samtec TSW-104-07-L-D
(1)
The device installed at location U1 depends on the EVM ordered. This device is soldered to the board for best performance. U1
may be replaced with any device listed in the EVM-compatible device data sheets found in Table 1 .
SBAU140 – December 2008 Bill of Materials (BOM) and Schematic 21
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