Datasheet

AIN3
AIN4
AIN5
AIN6
AIN7
SCLK
DOUT
DIN
TM_BUSY
CS
ThermalPad
AIN2
AGND
AIN1
REF
AIN0
NC
PDRST/
DGND
DVDD
AVDD
6
1
2
3
4
5
15
14
13
12
11
20
7
19
8
18
9
17
10
16
ADS8028
www.ti.com SBAS549B –MAY 2011–REVISED MARCH 2012
PIN CONFIGURATIONS
RTJ PACKAGE
(1)
QFN-20
(TOP VIEW)
(1) The exposed thermal pad on the bottom of the package must be soldered to the printed circuit board (PCB) ground for proper
functionality and heat dissipation.
NOTE: NC = no connection.
PIN ASSIGNMENTS
NAME PIN FUNCTION DESCRIPTION
AGND 6 Supply Analog ground
AIN0 18 Analog input Analog input channel 0
AIN1 19 Analog input Analog input channel 1
AIN2 20 Analog input Analog input channel 2
AIN3 1 Analog input Analog input channel 3
AIN4 2 Analog input Analog input channel 4
AIN5 3 Analog input Analog input channel 5
AIN6 4 Analog input Analog input channel 6
AIN7 5 Analog input Analog input channel 7
AVDD 10 Supply ADC operation supply voltage
CS 11 Digital input Chip select; active low logic input
DGND 9 Supply Digital ground
DIN 13 Digital input SPI data input
DOUT 14 Digital output SPI data output
DVDD 16 Supply ADC interface supply voltage
This pin has no internal connection. Any passive component connected to this
NC 8 —
pin does not affect device functionality.
PD/RST 17 Digital input Dual function pin for power-down and reset operation; active low logic input
REF 7 Analog input/output ADC internal reference output or ADC external reference input
SCLK 15 Digital input SPI clock
Exposed thermal pad; this pin should be soldered to the PCB ground for proper
Thermal pad — Thermal pad
functionality and heat dissipation
Busy output; this pin transitions high and remains high during conversion for
TM_BUSY 12 Digital input
temperature sensor input
Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): ADS8028